A schematic of an exemplary raster-scanning direct laser writing (rDLW) printer.
Lead inventor: Tim Gardner
Co-inventors: Morgan Brown, Tim Gardner, Kara Zappitelli
Licensing contact: Christine Gramer

1. Technology Overview

The invention introduces a novel method for fabricating 3D electronic devices using 3D-printed electronic components. This technology leverages 3D printing techniques to create complex multi-electrode arrays for brain recording and stimulation, integrating neurotrophic factors to enhance functionality. The technology offers significant potential for applications in medical devices, wearable electronics, and robotics, providing a scalable and cost-effective solution for advanced electronic component fabrication. Currently in the development stage, this technology holds strong potential for commercialization.

2. Key Features and Benefits

  • 3D printing integration: Combines 3D printing with electronic device fabrication for precise control and rapid prototyping.
  • Enhanced functionality: Integrates neurotrophic factors into multi-electrode arrays for improved brain recording and stimulation.
  • Scalability: 3D printing techniques enable large-scale production and customization.
  • Versatility: Applicable to a wide range of medical devices, wearable electronics, and robotics applications.
  • Precision: Provides precise control over electrode placement and device functionality.

3. Applications and Market Focus

  • Medical devices: Enhancing the functionality and precision of brain recording and stimulation devices.
  • Wearable electronics: Providing scalable solutions for advanced wearable sensors and electronics.
  • Robotics: Supporting the development of complex electronic components for robotics and automation.
  • Research and development: Facilitating further innovation in electronic device fabrication and neurotechnology.
  • Custom solutions: Developing tailored 3D-printed electronic components for specific applications.

4. Commercial Advantages

  • Strategic benefits: Offers a scalable and efficient solution for advanced electronic device fabrication.
  • Implementation advantages: Simplifies the development of high-performance electronic components.
  • Market positioning: Positions the technology as a key enabler in medical devices, wearable electronics, and robotics sectors.
  • Competitive edge: Provides a unique and effective method for integrating 3D printing with electronic device fabrication.

5. Partnership Opportunities

  • Licensing partners: Ideal for companies in medical devices, wearable electronics, and robotics.
  • Cross-sector benefits: Offers advantages to multiple industries, including neurotechnology and automation.
  • Market opportunities: Addresses diverse market needs, from brain recording devices to wearable sensors.
  • Collaborative development: Potential for joint ventures with research institutions and technology firms to further enhance the technology.
Patent filing: US12245369B2
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